Overview
After years of steady SoC and ASIC aggregation to pack more functionality into a monolithic single die, the semiconductor industry can no longer meet growing performance demands. In the face of performance, area constraints, and reticle limits, and with the cost of production at advanced nodes skyrocketing, there is renewed interest in a disaggregated approach to chip development. Cadence® die-to-die (D2D) connectivity solutions are optimized for various applications.