Key Benefits

Cadence® RF/microwave solutions allow you to tackle challenging RF to millimeter-wave (mmWave) front-end component and wireless subsystem design from concept through signoff in silicon radio frequency integrated circuits (RFICs), III-V compound semiconductors, PCBs, and multi-technology modules.

Fast, Accurate Results

Ensures greater first-pass design success with proven simulation technology

Productivity

Design automation that reduces manual effort and potential design errors to speed up development time

Empowering

Smart, customizable design flows for high-frequency semiconductor and PCB technologies

Interoperable

Co-design across multiple software platforms and manufacturing flows

Offerings

RF to mmWave front-end components for wireless communications and sensors require advanced technology integration and semiconductor processes to meet aggressive size, weight, and performance targets. Powerful simulation technology, RF-aware models, and design automation from Cadence help reduce development time and costs in communications, aerospace and defense, and automotive applications.

 

 

III-V and MMIC Design Overview

III-V compound semiconductor devices such as gallium arsenide (GaAs) and gallium nitride (GaN) offer superior RF performance for mobile devices, communications infrastructure, and aerospace and defense applications. Achieving optimal performance requires reliable circuit simulation, electromagnetic (EM) verification, communication testbenches, and a design flow that links electrical design to physical realization. The Cadence® AWR Design Environment® platform offers a leading front-to-back monolithic microwave integrated circuit (MMIC) design flow with an innovative user interface and complete integration of design entry, simulation, and physical design tools that enhances engineering productivity and ensures first-pass success. 

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RF PCB Design Overview

To support increasing functionality, PCBs employ more complex board structures designed for a range of specialized applications. Offering a layout-driven design methodology for complex RF PCBs, Cadence  supports accurate modeling of PCB transmission media from the RF signal path to digital control and DC bias lines. Circuit/system and EM co-simulation provide first-pass design success with complete PCB analysis of surface-mount components, interconnecting transmission lines, and embedded and distributed passive elements, as well as EM verification. 

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RFIC and Module Design Overview

Demand for more sophisticated wireless connected devices is driving the need for a new generation of high-performance, cost-sensitive silicon products, often implemented in highly integrated, multi-device and multi-fabric modules. Cadence Virtuoso® RF Solution offers RF analyses built on silicon-proven simulation engines in both the time and frequency domain. These provide design insight and enable verification of broad RFIC types, including mixers, transceivers, power amplifiers, dividers, switched capacitors, filters, and phase-locked loops (PLLs). This powerful design environment supports RFIC, RF module, and package co-design to eliminate design failures from manual translation of data.

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