概述
用于图像处理,机器视觉和AI的第六代视觉DSP
Cadence Tensilica Vision 230 DSP 每秒可执行多达 2.18 万亿次操作 (TOPS),是 Vision 130 DSP 的 2.6 倍。为了满足嵌入式视觉和人工智能应用日益增长的计算要求,与 Vision 130 DSP 相比,第六代 Vision 230 DSP 提供了高达 2 倍的人工智能和浮点运算性能。Vision 230 DSP 专门针对实时定位与地图构建 (SLAM) 进行了优化,这种技术通常用于机器人、无人机、手机和汽车市场,以自动构建或更新未知环境的地图,并可用于 AR/VR 市场的内向外追踪技术。
核心优势
面积和功耗优化
与主 CPU 和 GPU 相比功耗较低
视觉/图像处理
针对计算机视觉和图像处理应用优化的指令集
高性能
> 1TOPS 的 AI 性能,可用于对象检测、图像分类、图像分割
主要功能
Cadence 通过自身的 Tensilica 处理器 IP 融合了业界优异的产品和服务,可帮助您加快系统级芯片设计的开发,同时达到严苛的功耗和性能要求。浏览下方的 Tensilica 处理器 IP 服务合作伙伴列表。
Partners
Cadence, through its Tensilica processor IP, brings together best-in-class products and services from industry leaders to help you accelerate the development of your SoC designs while meeting your demanding power and performance requirements. Browse the list of Tensilica processor IP service partners below.
Technologies
Functional Safety for Automotive
Cadence is committed to enabling Functional Safety applications across the Tensilica processor lineup, whether it's an off-the-shelf processor/DSP IP or a custom domain-specific processor for a specific application
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Differentiate, reduce time to market, add flexibility, and get the best performance, power, and area
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Customize your DSPs/processors for optimized performance, energy efficiency, and differentiation
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Create a perfect match for your application, guaranteed correct by construction
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Cadence is committed to keeping design teams highly productive with a range of support offerings and processes designed to keep users focused on reducing time to market and achieving silicon success.
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