Overview
Efficient DC Analysis for IC Package and PCB Signoff
To ensure you achieve reliable power delivery, Cadence Celsius PowerDC technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation, to maximize accuracy. Celsius PowerDC technology quickly pinpoints excessive IR drop, with areas of excess current density and thermal hotspots, to minimize your design’s risk of field failure.
Key Benefits
Fast, Accurate DC Analysis Provides Sufficiency, Efficiency, and Stability for Power Needs
Easy-to-Deploy Workflow
Ideal for occasional users and experts alike
Accurate
Highly accurate, even for complex designs with multiple voltage domains and complex plane structures, providing conclusive IR drop analysis for package and board
Save Time and Budget
Avoid costly implementations, engineering delays, and field failures
Features
Lower Costs, Reduce Delays, and Prevent Field Failures
Training and Support
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