OVERVIEW
Complete Electrothermal Technology for IC Packages, PCBs, and Systems
The Cadence Celsius Thermal Solver is the industry’s first complete electrothermal co-simulation solution for the full hierarchy of electronic systems from chips, packages, and boards to full physical enclosures. The software provides analysis and design insights that empower electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.
KEY BENEFITS
Thermal Analysis Delivering Speed, Accuracy, Capacity, and Streamlined Workflows
Design Insight
Minimizes late-stage design iterations, costly implementations, engineering delays, product iterations, and field failures by enabling designers to perform thermal simulations early in the design phase
Greater Productivity
Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy
Electrothermal Reliability
Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations
Complete System Analysis
Multiphysics technology combines FEA for solid structures with CFD for fluids to enable detailed analysis of the entire system
Features
APPLICATIONS
Your Most Complex Thermal Challenges — Solved
SoCs
Floorplan optimization, performance analysis using voltage/frequency corners under thermal constraints, and accurate temperature sensor location.
MMICs
Solutions for RF power amplifier (PA) and monolithic microwave IC (MMIC) designs and RF PCBs and modules that support electrothermal analysis through model information sourced from circuit design software, including existing MMIC design data and geometries such as layout, material properties, and power-source values from RF simulation.
IC Packages
Transient electrothermal co-simulations to accurately identify temperature and current density issues in packages.
PCB Modules
Electrothermal co-simulation for full PCB design without any simplification and calculation of IR drop by calculating on the joule heating.
Systems
Develop a thermal management system and identify hot spots and thermal stress-related issues that are among the leading field failure risks in electronic systems.
Customer Stories
Hear what customers have to say
The Cadence Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results.
Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics Division, Robert Bosch GmbH
The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.
Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm
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