主要な利点
チップ／パッケージ協調設計
より高速、低価格なパッケージの開発をサポート
マルチチップ、チップレット設計
マルチチップ、チップレットのヘテロジニアス統合設計をサポート
包括的な設計
FOWLP（fan-out wafer-level package）に対応する解析・検証環境
リファレンスフロー
主要ファウンドリおよびOSAT（Outsourced Semiconductor Assembly and Test）ベンダーの最先端パッケージに対応
Resources
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Video
Gain PPA Advantages with New Aging-Aware STA Solutions for High-Performance Semiconductor Designs
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Video
CadenceTECHTALK: Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
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Video
Team Collaboration With Allegro Symphony | Allegro PCB Designer
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Training and Support
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