Past Events

On-Demand CadenceTECHTALK: Why Meshing Complex Marine Geometries Has Never Been So Easy

Witness the next generation of meshing for marine applications: Mesh any geometry at the highest level of accuracy and speed, guaranteed. Register for the webinar. In this 30-minute webinar focusing on marine applications, we present various new meshing features that will accelerate your workflow at all levels, from CAD preparation to mesh analysis, creating a solid basis for high-accuracy CFD simulation.

CadenceLIVE Japan 2022

CadenceLIVE Japan 2022 will be held on July 15 at Yokohama Bay Hotel Tokyu. It features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products.

CadenceTECHTALK: Digital Engineering Best Practices for Aerospace and Defense

Watch this CadenceTECHTALK™ webinar, where senior group director, solutions & ecosystems Frank Schirrmeister will discuss how commercial electronics hardware companies use cutting-edge design techniques to ensure that their hardware/software designs work as intended prior to fabrication.

2022 Cadence中国技术巡回研讨会—深圳站

2022 CadenceCONNECT: China Technology Day is coming soon! This year we will hold seminar in many cities including Shenzhen site. Cadence will bring you best practices and ideas. Come and join in us!

CadenceTECHTALK: Driving Low-Power Design with High-Level Synthesis

Discover how to drive low-power design with high-level synthesis. Join us for a webinar that shows you how to optimize your design techniques for low power while meeting performance goals. Register today.

CadenceTECHTALK：Fidelity AutoMesh — 极速化前处理

In this CadenceTECHTALK, we will show you advantages of Cadence Fidelity CFD software. Please join in us for 1 hour free webinar

CadenceTECHTALK: Discover Fidelity CFD Software for Faster, High-Accuracy Multiphysics Simulation

Discover how Cadence® Fidelity™ CFD Software accelerates and optimizes your design flows. Join this webinar to learn how Fidelity unites all the compelling technologies a CFD engineer needs to simulate the performance of multiphysics systems in a streamlined workflow. Fidelity offers a comprehensive suite of solutions for multiple vertical markets, including automotive, turbomachinery, marine, aerospace, and more.

CadenceTECHTALK: Solutions to Detect Design Errors Early to Reduce Design Iterations

Watch this webinar recording to learn about preventing methods of signal integrity issues and how our signal integrity tool, Sigrity™ Aurora, can help you identify the ideal corrective action efficiently to solve fundamental problems.

On-Demand CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Join us for this one-hour webinar to learn how to use an initial SiP file from the Cadence® Allegro® Package Designer to enable IC-package co-design in the Cadence Virtuoso® platform and keep the SiP database and OpenAccess database in sync in the Virtuoso platform. This webinar will cover discussions on modifying a system design in the Virtuoso platform and incrementally updating the corresponding SiP file, reviewing and accepting/rejecting updates to the initial SiP file in the Virtuoso platform.

CadenceTECHTALK：原理图系统设计的划时代工具

In this CadenceTECHTALK, we will show you advantages of Cadence Allegro System Capture. Please join in us for 1 hour free webinar

Accelerate Time to Market by Enhancing Cross-Team Collaboration in Real-Time

In this joint webinar with OpsHub, we will discuss how teams can proactively manage requirements compliance with real-time data by establishing full traceability and collaboration between verification requirements, verification test cases and outcomes. Join our subject matter experts in this webinar to understand how connecting vManager data bidirectionally with other tools in real-time.

On-demand CadenceCONNECT: Club Formal 2022 - Asia Pacific and Japan (English)

Club Formal is a valuable opportunity to learn and communicate use cases examples shared by advanced customers.

On-demand CadenceCONNECT: Club Formal 2022 - Asia Pacific and Japan

今年のClub Formalでは、日本だけではなく広くAsia-Pacificからのユーザ事例をご紹介いたします。

On-Demand CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

Join our CadenceTECHTALK to discover the challenges of PCB designs today and learn more about thermal only versus dynamic IR drop analysis. We will also demonstrate the Cadence® Celsius™ Thermal Solver’s ability to perform both static and dynamic IR drop analyses.

CadenceCONNECT: Digital Full Flow Technology Day

In this full-day, in-person seminar, we will discuss the entire portfolio of the Cadence® integrated digital full flow, which offers innovations that go across individual tool boundaries by integrating core engines and key technologies that allow you to beat your PPA goals ahead of schedule.

CadenceTECHTALK：基于Allegro PCB 设计平台的Rigid-Flex Board Design

In this CadenceTECHTALK, we will show you advantages of Cadence Allegro PCB Designer. Please join in us for 1 hour free webinar

Cadence TECHTALK: Tensilica IP系列线上研讨会

Join us for 2022 Cadence TECHTALK: Tensilica IP Series. In this webinar, Cadence will explore the latest Cadence® Tensilica® IP developments. You could learn how customers can quickly create differentiated, domain-specific processors for their application needs with the help of Cadence® Tensilica® IP’s proven technology. Make sure you leverage their expertise with IP solutions for the development of your next generation of electronic devices. Welcome to register!

CadenceLIVE Silicon Valley 2022

CadenceLIVE Silicon Valley 2022 will be held on June 8-9 at the Santa Clara Convention Center. It features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings together users, developers, and industry experts to connect, share ideas, and inspire design creativity.

On-Demand CadenceTECHTALK: 輕鬆完成先進封裝/PCB共同系統電源完整性分析 (Taiwan)

Power integrity on PCB and package are closely related to chip-level design. Also, the die current is critical to planning PCB and package components and construction. Therefore, target impedance is quickly becoming the preferred method by IC vendors to specify package and board-level AC PDN requirements. This session first presents a practical method for how target impedance may be determined by IC vendors, including IC PDN transient current waveforms and impedance profiles. Then will provide an output impedance profile to let PKG/PCB designer follow up on the system PDN design.

CadenceTECHTALK：电热联合仿真：提高热签核精度

Please join this free one-hour webinar to learn how to use Cadence® Celsius™ Thermal Solver

On-Demand CadenceTECHTALK: 完美實現訊號完整性分析 - 通用拓樸探索環境探勘(Taiwan)

Sigrity Topology Explorer is a general-purpose topology exploration environment that can be used for what-if analysis of signals, power, or both signals and power together. The new signal integrity simulation interface uses the method of topology to achieve system-level time-domain analysis.

CadenceTECHTALK：Via modeling and optimization

Please join this free one-hour webinar to learn Cadence High Speed Structure Optimization

CadenceTECHTALK：使用 Clarity 3D Solver进行快速简单的软硬结合板分析

Please join this free one-hour webinar to learn how to use Cadence® Clarity™ 3D Solver

On-Demand CadenceTECHTALK: 3D-IC 應用難解? 熱電協同多物理場分析即刻救援(Taiwan)

This CadenceTECHTALK will showcase the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius Thermal Solver helps you solve this problem with multiphysics of co-simulation for the whole system and enables you to improve temperature, electrical properties, and stress at an early stage.

On-Demand CadenceTECHTALK:迎擊最複雜的EM挑戰! Clarity 2022.1求解器加速3D FEM 模擬分析 (Taiwan)

The latest 2022.1 release continues to widen the gap between the Clarity 3D finite element (FEM) solver and alternatives in both performance and capacity for chip, interposer, package, and PCB.

On-Demand CadenceTECHTALK:簡單、易用、方便提升PCB /封裝設計速度和效率(Taiwan)

This presentation will introduce the latest new features in Allegro PCB Editor and Allegro Package Designer Plus 17.4. These features provide a more flexible and more useful methodology when faced with different design situations.

On-Demand CadenceTECHTALK:超實用技巧策動高效率PCB設計 (Taiwan)

This webinar will present Allegro PCB Editor and Allegro Package Designer Plus 17.4 performance enhancement on display and shape. It can help users to increase design efficiency and reduce the design cycle time.

On-demand CadenceTECHTALK: Midas機能安全プラットフォームによるFMEDAベース機能安全ソリューションのご紹介

ケイデンスが提供するMidas機能安全プラットフォームを用いた、デジタルおよびアナログの設計・検証を包含したFMEDAベースの機能安全フローの構築についてご説明します。なお、このビデオをご視聴いただくためには、cadence.comへのログインが必要となります。

On-Demand CadenceTECHTALK: 快速In-Design電磁分析實現Microwave/ RF 精確設計與驗證流程 (Taiwan)

This CadenceTECHTALK presents key best practices that can help designers achieve accurate simulation results in a short timeframe. In addition, we will highlight CAD techniques for leveraging EM simulation to analyze and optimize designs much more rapidly than by using the sheer brute force of large numbers for distinct EM simulations.

Cadence Training Webinar: Enhancing Layout Productivity with Virtuoso Layout Pro Training

The Cadence® Virtuoso® Layout Suite offers you enhanced accelerated performance and productivity, from advanced full custom polygon editing through more flexible schematic-driven and constraint-driven assisted full custom layout to full custom layout automation. The Virtuoso Layout Suite is seamlessly integrated with the Virtuoso Schematic Editor and the Virtuoso ADE Product Suite—letting you create differentiated custom silicon that is both fast and silicon accurate.

CadenceTECHTALK：如何不牺牲精度以提升模拟仿真性能

In this CadenceTECHTALK, we will show you advantages of Cadence Spectre X Simulator. Please join in us for 1 hour free webinar

On-Demand CadenceTECHTALK: FMEDA-driven Safety Solution for Faster Certification of Automotive and Industrial Designs

Watch the recording of this CadenceTECHTALK™ to learn about Cadence Safety Solution offerings for improved productivity and accelerated safety compliance. Understand the Midas Safety Platform—a standardized, unified safety cockpit—fully integrated with Cadence design and verification flows to enable FMEDA-driven digital and analog/mixed-signal design of safety-critical semiconductors.

CadenceTECHTALK：高效模拟 IC 设计和验证的秘诀是什么？

In this CadenceTECHTALK, we will showcase the latest features of the Virtuoso ADE Product Suite. Please join in us for 1 hour free webinar

On-Demand CadenceTECHTALK: Tackling Advanced Analog FinFET Front-End Design Challenges with Better Methodologies

In this CadenceTECHTALK, we will discuss some of the FinFET design challenges and show how Cadence’s comprehensive and silicon-proven methodology addresses them. Learn how to facilitate conversation between design and layout engineers to simplify the time-consuming “back-and-forth."

On-Demand CadenceTECHTALK: (Taiwan) Improving Debug Productivity with Indago

In this CadenceTECHTALK, you will learn how the Cadence® Indago™ Debug Analyzer is addressing these concerns by introducing higher performance waveform dumping, better UVM debugging capabilities, faster startup times even with large SoCs, and responsive search and driver tracing capabilities.

Cadence Training Webinar: Signal and Power Integrity Analysis with Sigrity Aurora

Cadence® Sigrity™ Aurora is a signal and power integrity (SI/PI) analysis solution, tightly integrated into the Allegro® PCB design environment. Bridging the gap between design and analysis with In-Design Analysis (IDA) features, Sigrity Aurora reads and writes directly to the Allegro PCB database and provides fast and accurate integration of design and analysis results.

CadenceTechTALK: Automate Chip Design with ML for Productivity and Performance Gains

Achieve 10X productivity and a 20% performance gain using machine learning to automate and optimize chip design. Attend this CadenceTECHTALK to hear how customers use the Cadence Cerebrus Intelligent Chip Explorer to achieve these results and more.

CadenceTECHTALK: 使用 Xcelium Simulator 简化混合信号SoC芯片验证

Analog and mixed-signal verification has always been a challenge for design and verification engineers. It has become tedious with the increasing complexity of SoC designs. Join this webinar to learn how Cadence is providing effective verification and debug methodologies using RNM of analog blocks for mixed-signal SoC verification.

Google Cloud Seminar (Taiwan)

Join us at Google Cloud Taiwan Seminar to learn Cadence presentation on Simplifying Giga-scale Designs with EDA-optimized Cloud. You will know how Cadence Cloud is driving the future of electronic design automation and how to bridge the gap between available EDA resources and increasing complexity and size of designs.

On-Demand CadenceTECHTALK: Accelerating Complex SoC Prototyping with Protium X2

This CadenceTECHTALK will offer an overview of the Protium™ Enterprise Prototyping Platform for fast hardware and software verification. We will review the traditional prototyping challenges of complex SoCs using a 5G AI-enabled mobile SoC case study—RTL changes required for clocks management, memories, interfaces, multi-FPGA partitioning, and multi-user support. Learn how the Protium X2 platform features and solutions solve these challenges while accelerating the hardware/software co-design verification schedule.

CadenceTECHTALK: 提升调试效率

Verification engineers spends on an average nearly half of their time debugging, so it is no wonder that debug performance and throughput are among their top concerns. In this CadenceTECHTALK, you will learn how the Cadence® Indago™ Debug Analyzer is addressing these concerns by introducing higher performance waveform dumping, better UVM debugging capabilities, faster startup times even with large SoCs, and responsive search and driver tracing capabilities.

CadenceTECHTALK：Conformal ECO：流程与方法

Please join this free one-hour webinar to learn how to use Cadence® Conformal® ECO Designer

CadenceTECHTALK：使用Common UI 数据库访问格式和脚本以提高工作效率

Please join this free one-hour webinar to learn how to use the powerful Stylus Common UI infrastructure.

On-Demand CadenceTECHTALK: In-Design EM Analysis: Microwave/RF Design and Verification Workflows

Discover key best practices for proper electromagnetic (EM) analysis to help you achieve accurate simulation results in a short timeframe. This CadenceTECHTALK highlights CAD techniques for leveraging EM simulation to analyze and optimize designs much more rapidly than by using the sheer brute force of large numbers for distinct EM simulations.

2022 MATLAB & Simulink Smart Factory Forum -AI for Data Analytics

Join Cadence at 2022 MATLAB & Simulink Smart Factory Forum -AI for Data Analytics. Free registration to attend the virtual co-speech “System Design Challenges and Solutions for Smart Manufacturing” by Cadence Taiwan and Terasoft.

CadenceTECHTALK: Power Integrity – Tips and Tricks to Minimize PDN Noise

Join this webinar, as we explore common Power Delivery Network (PDN) problems in many designs today, and get tips and insights from our experts on resolving your Power Integrity (PI) issues before they occur.

On-Demand CadenceTECHTALK: Overcoming System-Level 3D-IC Electrical and Thermal Challenges

The last webinar series, "Adopting a Faster, More Efficient Path to Multi-Chiplet Design," will address the growing system analysis challenges 3D-IC designers face related to signal, power, and thermal integrity and will demonstrate how facing these concerns through simulation during system planning and signoff accelerates the 3D-IC design cycle.

Training Webinar: Embracing Datapath Verification with Jasper C2RTL App

Current verification techniques cannot keep pace with the growing arithmetic nature of todays’ designs. With the advent of AI, cryptography, and other emerging domains, the amount of datapath in designs today is growing exponentially. These datapath designs typically involve arithmetic units doing integer, fixed-point, and floating-point operations for matrix multiplications, polynomial computations, FFTs, and many other complex arithmetic functions.

On-Demand CadenceTECHTALK: How Clarity 3D Solver Advances 3D FEM Analysis

Join us as we unveil the Clarity 2022.1 release highlights, covering advances in meshing and frequency sweep technology, and revealing some significant advances that enable the secure integration of third-party mechanical components into your designs.

On-Demand CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis

Next session in "Adopting a Faster, More Efficient Path to Multi-Chiplet Design" webinar series will help you to get a chip-centric perspective on performing PI and thermal integrity analysis in 3D-ICs from early planning to signoff.