Overview
EM-IR and Power Signoff Closure for SoCs
The Cadence Voltus IC Power Integrity Solution is a comprehensive full-chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, the Voltus IC Power Integrity Solution provides very fast analysis and has the capacity to handle the largest designs in the industry. The Voltus solution enables IR-aware implementation and rapid design closure through seamless integration with the Cadence Innovus Implementation System and Cadence Tempus Timing Solution. Integration with Cadence Sigrity technologies and Cadence Celsius Thermal Solver enables system-level power integrity and thermal analysis.
Key Benefits
Fast, Accurate, and Integrated Power Signoff Solution
Powerful Performance and Capacity
Flexibility to run designs in private or public cloud using massively parallel and hierarchical analysis solution
Accurate Analysis
Certified for accuracy by leading foundries down to 3nm and highly accurate transient analysis with CCSP libraries and Voltus-Fi models
Seamless Integration
Integrated with Cadence digital, signoff, and system analysis products to offer IR-aware implementation with system-level power integrity and thermal analysis
Usability
Super-fast distributed GUI, web-based design explorer, and fast data mining with customizable queries
Highlights
A Complete In-Design-to-Signoff Power Integrity Solution
The Voltus solution is a Comprehensive EM-IR, power, and reliability platform leveraging its distributed architecture to boost performance and capacity. It enables rapid design closure from early analysis to chip+package power integrity signoff capabilities.
Early Analysis
The integrated solution with the Innovus Implementation System and Integrity 3D-IC Platform offers power grid optimization with early rail analysis and IR-aware implementation for individual dies and 3D-ICs.
Power
Leverage the full range of power analysis capabilities including RTL power analysis, glitch power estimation, and gate-level power signoff. The Voltus solution includes a very high-performance, physically aware distributed vector profiler, as well as support for all industry-standard vector formats, including fsdb, SAIF, SHM, and TCF.
Robustness
To verify power grid robustness, you can use a full range of checks and analysis, including missing via and short checks. Static IR drop and resistance analysis let you catch weak spots in the power grid.
Dynamic Noise
Dynamic power grid voltage drop is becoming a big challenge in advanced nodes. On top of vector-based transient analysis, the Voltus solution provides multiple vectorless transient methods to make sure your design has 100% coverage. SPICE package models are supported to include package impact on dynamic voltage drop.
Low-Power Designs
The Voltus solution supports analysis of low-power power-gated designs with accurate power gate characterization, inrush analysis, LDO modeling, and power gate optimization. Both UPF and CPF formats are supported.
Reliability
Power and signal electromigration (EM) analysis are certified by all major foundries. Advanced-node EM checks include self-heat analysis and support for statistical EM budgeting. The Voltus solution also includes a comprehensive electrostatic discharge (ESD) analysis solution with easy-to-use interface and GUI support.
3D-IC and System Analysis
The Voltus solution integrates with Cadence system-level extraction tools to include system-level impact of package and board on the chip power network. It also has the ability to perform full 3D-IC co-simulation with package and interposer models. As part of the on-chip analysis or 3D-IC analysis, you can create chip electrical and thermal models for system-level tools to perform system-level power integrity and electrothermal analysis.
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