OrbitIO System Planner Training
Date | Version | Country | Location | |
---|---|---|---|---|
Scheduled upon demandOn demand | EXPRESS INTERESTINQUIRE |
Version | Region | |
---|---|---|
17.2-2016 | Online | ENROLL |
16.6-2015 | Online | ENROLL |
Other Versions | Online | EXPRESS INTERESTINQUIRE |
Length : 1 day
Course Description
Cadence® OrbitIO™ System Planner helps design teams quickly assess and plan connectivity between the die and package in context of the full system — all within a single-canvas multi-fabric environment. It’s ideal for system architects or anyone responsible for developing the die-to-package interface and coming up with the optimal combination of bump/ball configurations and net assignments. It helps semiconductor companies evaluate route feasibility of the package, as well as develop and communicate a route plan to their package design resources.
Learning Objectives
After completing this course, you will be able to:
- Define and edit bump and ball pad patterns parametrically
- Automatically allocate ratio-driven signal, power and ground pins
- Floorplan critical nets and interfaces
- Map nets across fabrics
- Create bundles and flow plans for detailed connection assignment
- Import devices and route bundles into SiP Layout for implementation
Software Used in This Course
- OrbitIO System Planner
Software Release(s)
SPB17.2-2016
Modules in this Course
- User Interface
- Creating and Importing Design Components
- Hierarchy and Net Mapping
- Personalities
- Optimization
- Debugging Problems
Audience
- Layout Designers
- Electrical Engineers
Prerequisites
You must have:
- A basic understanding of printed circuit boards and IC packages
Related Courses
Course ID: 86169