Legato Reliability Solution
Industry’s first complete analog IC design for reliability solution
Key Benefits
- Improves test coverage of manufacturing test using analog defect simulation
- Advanced aging analysis better predicts device operating lifetime
- Performs dynamic electrothermal simulation of design to prevent thermal overstress during operation
- Analog defect simulation is integrated into the Spectre AMS Designer to enable simulation of mixed-signal design
- Based on Virtuoso custom IC design platform and Spectre Accelerated Parallel Simulator (APS) for fast, easy adoption
- Part of the Cadence Safety Solution providing automated fault identification and diagnostic coverage for analog/mixed-signal design failure modes
One of the most difficult challenges in analog IC design is the increased pressure to make sure mission-critical devices in applications like automotive, medical, industrial, and military/aerospace perform longer and more reliably in any condition or environment. Without a solid solution to solve these design challenges, the cost of failure can be very high and even life-threatening.
The Cadence® Legato™ Reliability Solution combines best-in-class Virtuoso® and Spectre® technologies to overcome design roadblocks and avoid failures in the field due to analog faults, device aging, electromigration, process variation, and thermal and packaging effects. The solution provides a confident design pathway to:
- Safety through simulation tools to detect failure and analysis of failure recovery for safety mechanisms
- Reliability with advanced degradation models enabling more accurate predictive device aging over time due to internal device and environmental pressures
- Quality to target 0 DPPM using automated defect identification tests to analyze results through the Spectre® Circuit Simulation Platform
Increased design complexity amplifies challenges. The Legato Reliability solution helps designers avoid these field failures and enables customers to achieve ISO 26262 certification through:
- Analog Defect Analysis: To reduce test cost and eliminates test escapes
- Electrothermal Analysis: To prevent thermal overstress and avoid premature failures
- Advanced Aging Analysis: To accurately predict product wear-out