A New Way to Tackle System-Level Power Integrity Analysis
With the massive increase in bandwidth coursing over the internet today, design challenges for applications like telecom, data centers, and cloud infrastructure have all increased as well. One of these key challenges is power integrity. Power integrity analysis has morphed over the last 20 years from back-of-the-envelope calculations to detailed extraction, simulation, and signoff of physical PCB and package layouts. But now the need pushes beyond a single physical fabric to include representations of the ICs, interposer/packages, PCBs, and VRMs all together in a single view, to be analyzed together as a complete power distribution system (PDN).