Course Description
In this course, you learn the complete flow of a System in Package (SiP) design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output. You also learn the complete design flow for a flip-chip and wire-bonded stacked die module using the Cadence® SiP Layout software.
Learning Objectives
After completing this course, you will be able to:
- Develop a process flow to suit your design needs
- Create a cross section and design constraints in your SiP layout database
- Wire bond a stacked die design
- Use the 3D viewer to check your design in three dimensions
- Route an SiP design using interactive and automatic methods
- Generate a variety of manufacturing outputs for your SiP design
Software Used in This Course
- Cadence SiP Layout – XL
Software Release(s)
17.2
Modules in this Course
- Introducing SiP Layout
- Creating a New Package Design
- Modifying Components and Netlist
- Setting Design Rules
- Wire Bonding
- Die Stacks and 3D Viewing
- Routing and High-Density Interconnect
- Embedded Components
- Design Verification and Manufacturing Output
Audience
- IC package and SiP designers
Prerequisites
Before taking this course, you should have a working knowledge of:
- IC package design and construction
Related Courses
ONLINE TRAINING
Genus Synthesis Solution v16.1
This online class features the Cadence® Genus™ Synthesis Solution with next generation synthesis capabilities and how SoC design productivity gap is filled by Genus
"This is great training to move forward using new Software for hybrid design. All material about lectures and labs have been documented properly with theory, pictures and examples, and we had good support with examples, media and computers!"
Juan Lopez, International Rectifier
"I am highly impressed of the good quality of this training and training delivery."
Eugeny Ovchinnikov, JSC Russian Space Systems