Webinar
Modeling and Fabrication of High-Power, High-Efficiency Packaged RF GaN Devices
![Modeling and Fabrication of High-Power, High-Efficiency Packaged RF GaN Devices](/content/dam/cadence-www/global/en_US/images/resources/On-demand-webinars/modeling-and-fabrication-of-high-power-high-efficiency-packaged-rf-gan-devices.jpg)
Jack Brunning, Gallium Semi
This European Microwave Week (EuMW) webinar presents a practical approach to developing a high-power, packaged GaN MMIC amplifier, addressing common challenges in product design including device modeling, harmonic load impedance terminations to achieve high power-added efficiency for multi-market applications and IC/package integration.