Design and Verification of Advanced Antenna-in-Package Systems

In the presentation by Andy Heinig of Fraunhofer IIS/EAS, we will show how complex antenna-in-package systems can be designed and verified. Using an antenna-on-chip or antenna-on-substrate, the path from the transistor to the antenna is short and less complex. In advanced packages, the path is defined by complex structures often from different materials, through-hole connections, and also interference with other signals nearby. A lot of challenges, but with an appropriate design flow, the gain of using advanced packages is tremendous. For designing such systems, certain analyses are necessary. To get suitable simulation results, you need to fit measured test structures to simulated results. To get this correlation, a bundle of test structures must be developed. If the simulation tools are fitted with the measured values from the test structures, the design of complex interconnects and antenna structures is possible with a good correlation afterward. We will present the whole flow, from the designing of test structures up to the design, and the verification of complex antenna-in-package systems.