Can you risk the thermal performance of your next design to the constraints of the simplified models? And without transient thermal analysis of your high-speed designs? Watch this webinar recording to lear...
This Cadence TECHTALK showcases Cadence® Celsius™ Thermal Solver capabilities for package and PCB designers that enable thermal aware performance optimization in the early stages of design. The software’s ...
A well-managed BOM can simplify your manufacturing process, reduce costs, and contribute to the overall efficiency of your production. In this week’s webinar, you will learn how the latest OrCAD X Platform...
From streamlining workflows to accelerating project timelines, we’ll showcase how the intuitive interfaces and simplified processes within Cadence’s new PCB layout solution reduce the learning curve, impro...
Join us online at AESIN TECHTALK where we discuss the thermal management of electric drivetrains, the importance of thermal simulation and the role that Celsius EC Solver can play in that process.
The Cadence Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs.
Learn how the intuitive interfaces and simplified processes within OrCAD X, Cadence’s new PCB layout solution can streamline your workflows, accelerate project timelines, reduce the learning curve, and imp...
Join us for 2022 Cadence TECHTALK: Tensilica IP Series. In this webinar, Cadence will explore the latest Cadence® Tensilica® IP developments. You could learn how customers can quickly create differentiated...
本次CadenceTECHTALK将全面介绍Xcelium Apps的产品组合,其中包括机器学习,混合信号,多核技术,安全验证,功耗Playback以及X-pessimism Removal。您将了解如何将本地集成的Xcelium Apps无缝混合并搭配,以更快实现验证目标。
Cadence PCB design and analysis tools simplify complex designs from concept to manufacturing using simulation-driven solutions.