Cadence Design Systems, Inc.

Cadence offers the broadest, most integrated end-to-end design solutions to help today’s electronic designers do their best work creating tomorrow’s products, for:

Analog and Digital IC Design

As a leader in custom, analog, RF, and mixed-signal design enablement, we provide a complete solution starting with tools and methodologies that enable fast and accurate entry of design concepts all the way through verifying the designs before they are produced in silicon. By selectively automating aspects of custom IC design, we allow engineers to focus on precision-crafting their designs and optimizing circuit performance.

For designing the digital parts of chips, over the past few years we have introduced entirely new, next-generation tools that improve productivity and speed the design process. This comprehensive tool family speeds the full design cycle from front-end design all the way to final silicon signoff convergence.

The Cadence IP portfolio includes pre-designed and configurable blocks that can be integrated quickly into chip designs, freeing the design team from re-designing these elements. This portfolio includes Tensilica DSPs for AI, vision, audio, IoT, and baseband applications; Denali memory and storage IP; and controllers for the latest standard interfaces including PCI Express (PCIe), USB, and Ethernet.

System Verification

The Cadence Verification Suite supports the company’s Intelligent System Design strategy, which enables system and semiconductor companies to create complete, differentiated end products more efficiently. The Verification Suite is comprised of best-in-class core engines, verification fabric technologies, and solutions that increase design quality and throughput, fulfilling verification requirements for a wide variety of applications and vertical segments. This unique mixture of software-based solutions with hardware accelerators delivers the shortest turnaround time and predictable quality. Our technology offers the only proven path for system-level power and signal integrity. We also offer Verification IP (VIP) to verify interface and memory standards.

IC Packaging and PCB Design

We offer the leading IC packaging and PCB design solutions for traditional and advanced 3D-IC solutions. Cadence IC packaging and cross-domain co-design automation provide efficient solutions in system-level co-design and advanced mixed-signal packaging, delivering the automation and accuracy to expedite the design process. Our PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow for right-first-time design.

Multiphysics and CFD Analysis

Cadence now offers electromagnetic interference (EMI), electromagnetic compliance (EMC), electrothermal, and computational fluid dynamics (CFD) tools. Our solutions include digital twin technology for data center project management. Predicting real-world product performance during the design process is paramount for selecting the optimal design of complex systems.

Molecular Modeling and Biosimulation

Cadence also offers molecular modeling and biosimulation software to improve drug discovery via industry-leading science, efficient algorithms, and cloud-native scalability.

Cadence is committed to being a socially responsible company by utilizing our people, product, and profit to drive community and social impact. We pride ourselves on our “One Cadence—One Team” culture that drives our market and industry-leading innovation and business success. Cadence is recognized as a Great Place to Work around the world, including as one of Fortune Magazine’s “100 Best Companies to Work For” over the last ten years. We have also earned global recognitions for our efforts around our environmental, social, and governance strategies.

Cadence invests in technology innovation and achieves operational excellence, under the guidance and leadership of some of the brightest minds and most experienced executives

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