The Need for Electro-Thermal Co-simulation

In this week's Whiteboard Wednesdays video, Tom Hackett explains the need for electrical-thermal co-simulation based on finite element analysis (FEA) to support SoC designs utilizing advanced packaging methods such as 3D IC stacks. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element Analysis