Conquering Electromagnetic and Thermal System Analysis Challenges

The boom in intelligent systems represents a primary business opportunity for our generation, and the companies that embrace this opportunity will be in a leadership position for decades to come. Your system has the complex task of understanding and controlling, in real-time, the mechanical components of the system.  This is true for applications ranging from smart doorbells to smart appliances to self-driving cars and aircraft, and from AI-enabled edge devices to 5G networks to hyperscale data centers. Each generation of these systems is more challenging and harder to achieve. System-level challenges such as heat dissipation, electromagnetic radiation, mechanical stress, vibration, and fluid flows are now impacting designs like never before. Engineers are now battling the very limits of physics to squeeze out the mandated performance while facing severe space and power constraints. To successfully address these challenges, a new vision for design is needed, one that is able to deal with the system-level forces impinging on the mechanical and electronic subsystems. What is needed is a system design solution that can extract models without simplification, simulate and analyze complex electromechanical systems, and deliver the mandated performance without any over-design.