gwZLH84uwvzy8gSp3stjeT
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Flip-Chip Co-Design Planning Using Cadence OrbitIO
Vincent Hool from Altera discussion on Package Co-Design Planning Using Cadence OrbitIO. Discussion on Challenges that package cost has become a significant portion of product component cost. Critical to be able to predict package cost and performance at early stage with limited information.
Last Modified: August 22, 2015
Duration: 16 min