Past Events

2022 Cadence中国技术巡回研讨会 - 北京站

2022 CadenceCONNECT: China Technology Day is coming soon! This year we will hold seminar in many cities including Beijing. Cadence will bring you best practices and ideas. Come and join us!

On-Demand CadenceTECHTALK: Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

The latest release of the Cadence® AWR Design Environment® platform allows product development teams to meet the challenging performance requirements of these wireless systems in less turnaround time, through a comprehensive RF to mmWave design, EM analysis, and front-to-back workflows. This webinar will demonstrate key new features that accelerate design entry and platform design sharing to enhance engineering productivity and ensure first-pass success.

CadenceCONNECT: Taiwan Verification Seminar

This seminar will cover, not only our latest product, Verisium AI-Driven Verification Platform, a suite of applications leveraging big data and AI to optimize verification productivity and efficiency, but many verification topics, including Xcelium Simulation, Verisium Debug Analyzer, Jasper RTL Apps, DPA for early power profiling, finally, System VIP on system verification. Come join us!

2022 IEEE Asia Solid-State Circuits Conference (Taiwan)

Cadence is a Silver Sponsor at IEEE A-SSCC 2022. This international forum presents the most updated and advanced chips and circuit designs in solid-state and semiconductor fields. Come to visit Cadence Booth for Industry Demo at 8F Sky Lounge, Grand Hotel.

2022 Asia Testing Symposium (Taiwan)

Cadence will join the IEEE Asian Test Seminar(ATS) 2022 at Taichung on November 21-23. The IEEE ATS provides an open forum for researchers and industrial practitioners worldwide and exchanges innovative ideas on System, Board device testing with design and manufacturing. Please join us and learn more about Cadence from two industry sessions on Driving Intelligent System Design with 3D-IC and From Chip D&T to Energy-Efficiency.

2023 ECEDHA Annual Conference and ECExpo

The ECEDHA Annual Conference and ECExpo is the only meeting of its kind, bringing together the largest concentration of ECE academia and industry throughout the United States and Canada. We’re excited to be a Gold Sponsor and network with attendees; connect with us at our booth, #408.

On-Demand CadenceTECHTALK: Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow

Workflow interoperability between the Cadence® AWR Design Environment® platform and the Allegro® PCB Design editor enables RF and layout teams to share data more efficiently, reducing design turnaround times and avoiding potential errors caused by manual entry. This webinar presents the RF-to-PCB workflow and highlights the ways in which design teams can improve productivity and time to market.

TSMC 2022 North America OIP Ecosystem Forum

Join Cadence at the TSMC OIP Ecosystem Forum and see how Cadence and TSMC are partnering to enable new technologies in today's data-centric world. Through presentations and our booth, learn about our innovations supporting TSMC customers.

On-Demand CadenceTECHTALK: Advanced Pre-processing and Unstructured Meshing in Fidelity 2022.2

Fidelity 2022.2 is a new release that vastly extends the capabilities of our pre-processing and unstructured meshing solutions. It features improvements in the geometry wrapping tool, gives more flexibility to generate high-quality surface-to-volume meshes for aerospace applications, improves performance for importing large geometries, and allows for automatically generating volume-to-surface meshes for automotive applications. Register today.

On-Demand CadenceTECHTALK: Protium Enterprise Prototyping: Higher Productivity, Lower Costs

Join our webinar as we identify the key requirements and challenges with prototyping, and how using enterprising prototyping systems like Cadence’s Protium system reduce the costs associated with them.

On-Demand CadenceTECHTALK: Modeling Unsteadiness with the Non-Linear Harmonic Method

Discover why unsteadiness is important in turbomachinery and how to model it with high accuracy achieving 100 to 1000 times faster simulations than full-unsteady methods. Watch this On-Demand recording today for a webinar that covers the basics of the NLH method, outlines how the essential characteristics of flow periodicity are used as a tool, and demonstrates the accuracy and effectiveness of NLH through a variety of test cases.

On-Demand CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges

Join our one-hour CadenceTECHTALK to learn how challenges related to MMIC/RFIC integration can be identified and resolved prior to tapeout through in-design EM analysis and MMIC/RFIC co-simulation using distributed, multiprocessing EM analysis for large-scale RF structures with the Cadence’s Clarity 3D Solver and AWR Microwave Office circuit design software.

ICECS 2022

The 29th IEEE International Conference on Electronics Circuits and Systems (ICECS) is an international conference dedicated to circuits and systems. Early career researchers and post graduate students can attend the Young Professional track to hear from Ciaran Haughey, Cadence IP team, on “What’s in the Locker? Verification Techniques for Interface Controller IP”

On-Demand CadenceTECHTALK: Best Practices to Achieve the Highest Performance using Xcelium Logic Simulator

Wondering how you can easily achieve up to 3X exemplary performance gains using Xcelium Logic Simulator. This webinar will provide a handy checklist of best practices covering umbrella performance switches, “access” levels, and simulation profiling to achieve the highest performance using Xcelium.

HPC芯片全流程验证解决方案专场研讨会 - 上海站

电子设计自动化领域领先的供应商 Cadence，诚邀您参加“ 2022 CadenceCONNECT: HPC芯片全流程验证解决方案”线下研讨会上海站。

On-demand CadenceCONNECT: Automotive System Design Seminar 2022

ゲストスピーカーをお招きし、自動車業界で取り組んでいる最新の技術についてご紹介いただきます。また、パートナー企業様およびケイデンスから最新の電子システム設計技術をご紹介します。

DesignCon 2023

Cadence is a Platinum sponsor of DesignCon—the premier high-speed communications and system design conference. Visit us in Booth 733 to see how you can improve your electromagnetic, electronic, and thermal designs with system analysis, tackle advanced IC packaging and cross-platform challenges, accelerate RF to mmWave designs, and successfully incorporate photonic ICs and designs with 112G SerDes and DDR IP.

On-demand CadenceTECHTALK: FastSPICEシミュレータ新製品Spectre FX Simulatorのご紹介

革新的なFastSPICEソルバーを投入したことにより、パフォーマンスと精度を飛躍的に向上した新製品 Spectre FX Simulatorをご紹介します。ビデオをご覧いただくためには、cadence.comにログインをしていただく必要がございます。

CadenceCONNECT: Photonics - Riding the Waves Along the Spectrum

Join Cadence for the CadenceCONNECT Photonics event and workshop on January 11 - 12 in San Jose, CA. On day one, we’re featuring presentations from industry and academic experts that will help you tackle many of your design challenges. On day two, you will have the opportunity to learn hands-on with Photonics experts.

VLSID 2023

Cadence is a Silver Sponsor of VLSID 2023. VLSID 2023 – the first physical conference post pandemic, acts a platform for industry and academia alike to discuss, deliberate and explore into the frontiers of semiconductor eco-system that could eventually enable disruptive technologies for global digitalization.

HiFiLeD Symposium 2022

Join us at HiFiLeD Symposium in December 2022. The topics will be range from issues concerning the complexity, reliability, accuracy and uncertainties in generating the High-Fidelity LES/DNS data, to their application towards turbulence and transition modeling. It will include progress on the underlying high-order numerical methods (HOMs), innovative approaches for CPU acceleration for LES and DNS, exploitation of massive parallel architectures, efficient post-processing on massive parallel hardware, innovative machine learning methods, as well as experimental data. Moreover, the Symposium offers the opportunity to communicate and exchange knowledge for academic researchers, graduate students, industrial engineers, as well as industrial R&D managers and consultants working in the fields of turbulent flow modeling, simulations, measurements, and multidisciplinary CFD applications.

IEEE MAPCON 2022

Cadence is a Bronze sponsor of IEEE MAPCON 2022. Visit us in Booth 4, our technical experts will be on hand to discuss the latest developments in design, analysis, and implementation of MMICs, RFICs and modules, IC packaging, power amplifiers, RF PCBs, 5G/IoT, radar systems, and more.

On-Demand CadenceTECHTALK: Generate the Best Mesh Every Time – Automatically

Unstructured meshing can automate much of the mesh generation process, saving significant engineering time and cost. However, controlling numerical errors resulting from the discrete mesh requires adaptation to the developing solution. Join this webinar to learn how Cadence CFD mesh adaptation methods use a continuous-size field that gets updated as the solution progresses. As a result, adherence to the underlying CAD geometry is maintained, and mesh quality is ensured.

28th Asia and South Pacific Design Automation Conference (ASP-DAC 2023)

Cadence is a proud sponsor of ASP-DAC, the largest conference in the Asia and South-Pacific regions on Electronic Design Automation (EDA) for VLSI and systems. It started in 1995 and is now hosting its 28th conference. ASP-DAC 2023 will be held in a hybrid format, providing you with an ideal opportunity to experience the latest technology and future directions in VLSI design and design automation through technical papers and tutorials. ASP-DAC also holds a Designers' Forum; attendees can hear presentations about the latest designs. Cadence experts Simon Chang, Senior AE Group Director, and Miao Lie, Senior Product Engineering Group Director, will be speaking at the conference; stop by to hear from them!

2022 EDA Workshop (Taiwan)

2022 電子設計自動化研討會將於12/10 &12/11於新竹關西舉辦，除了延續提升 EDA 產學界國際競爭力，也會探索產學界如何因應未來 EDA 與電子產業的變化、營造 EDA 領域人才創業的氛圍，以持續帶動國內 EDA 領域之研究發展。Join Cadence speech at EDA workshop to learn about 「The Future of Intelligent Chip Design」and visit our booth to know about Cadence and EDA industry.

On-demand CadenceCONNECT: Functional Verification Seminar 2022

Verisiumをはじめとする検証課題を解決する先進的ソリューションをご紹介したセミナーをオンデマンドでご視聴ください。

DVCon Europe 2022

Join Matt Graham, Product Engineering Group Director, on December 6 at 4pm for his presentation on Verification 2.0 – Multi-Engine, Multi-Run – AI-Driven Verification. This talk covers some of the near-term opportunities for applying AI and ML pragmatically to verification problems and presents potential future directions for AI and ML area. Be sure to visit booth #601 to learn how Cadence is leveraging big data and AI to optimize verification productivity and efficiency with the Verisium™ platform.

On-Demand CadenceTECHTALK: Accelerating Complex SoC Prototyping with Protium X2

This CadenceTECHTALK will offer an overview of the Protium™ Enterprise Prototyping Platform for fast hardware and software verification. We will review the traditional prototyping challenges of complex SoCs using a 5G AI-enabled mobile SoC case study—RTL changes required for clocks management, memories, interfaces, multi-FPGA partitioning, and multi-user support. Learn how the Protium X2 platform features and solutions solve these challenges while accelerating the hardware/software co-design verification schedule.

SGSジャパン／⽇本ケイデンス「いまさら？機能安全（半導体編）」無償セミナー

自動車関連の開発において半導体の重要性は年々増しており、各社様機能安全対応が進んでいますが、改めて半導体レベルの機能安全対応について見直す機会は少ないかと思います。SGSジャパン㈱様と日本ケイデンスで「半導体」にスポットライトを当て、セミナーを開催します（上記リンクは、社外へのサイトへ移動します）。

Arm Tech Symposia 2022 (China)

Join Cadence at Arm Tech Symposia China and see how Cadence bare metal solution helped our partners get first-time pass on operating system boot on their FPGA/silicon.

MIXDES

The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advantages in design, modeling, simulation, testing, and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators, and power devices. Cadence is a proud sponsor; stop by our booth to network with industry experts.

Cadence TECHTALK: Xcelium Apps：包罗万象的仿真

本次CadenceTECHTALK将全面介绍Xcelium Apps的产品组合，其中包括机器学习，混合信号，多核技术，安全验证，功耗Playback以及X-pessimism Removal。您将了解如何将本地集成的Xcelium Apps无缝混合并搭配，以更快实现验证目标。

CadenceTECHTALK：基于Allegro PCB 设计平台的Rigid-Flex Board Design

In this CadenceTECHTALK, we will show you advantages of Cadence Allegro PCB Designer. Please join in us for 1 hour free webinar

26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems

26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS) provides a forum for exchanging ideas, discussing research results, and presenting practical applications in the areas of design, test, security, and diagnosis of electronic digital and analog circuits and systems. Cadence is a proud sponsor; stop by our booth to network with industry experts.

ThermalLIVE 2022

Cadence will join ThermalLIVE to present “Thermal Integrity in High Performance PCB Designs” this year. This presentation will explore the thermal challenges in today’s complex PCB designs and discuss thermal only versus dynamic IR drop analysis. A demonstration of the Cadence® Celsius™ Thermal Solver’s ability to perform both static and dynamic IR drop analyses will be presented.

International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design

The 2023 edition of the International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design (SMACD) is a forum devoted to modeling, simulation, and synthesis for analog, mixed-signal, RF (AMS/RF), and multi-domain (nanoelectronics, biological, MEMS, optoelectronics, etc.) integrated circuits and systems, as well as emerging technologies and applications. Cadence is a proud sponsor and looks forward to engaging with the attendees at our booth and during our presentation.

CES 2023

Want to see exciting technology that is behind some of the biggest innovations at CES? Book a meeting now to visit the Cadence® invitation-only suites at CES 2023, January 5-8 at the Venetian Expo, Level 2, Titian 2201B.

On-Demand CadenceTECHTALK: Driving Low-Power Design with High-Level Synthesis

Discover how to drive low-power design with high-level synthesis. Watch this webinar that shows you how to optimize your design techniques for low power while meeting performance goals. Register today.

On-Demand CadenceTECHTALK: Low-Power Verification Using Xcelium Simulation

Watch this On-Demand recording webinar that shows how Xcelium simulation enables design verification teams to catch low-power issues very early in the verification cycle at the RTL phase with best-in-class performance and providing complete low-power coverage.

On-Demand CadenceTECHTALK: Tempus and DSTA

Cadence and Socionext invite you to an on-demand joint webinar. Register to learn how the latest innovations in the Cadence® Tempus™ Timing Solution can deliver faster time-to-signoff closure with the best power, performance, and area (PPA).

On-Demand CadenceTECHTALK: 輕鬆完成先進封裝/PCB共同系統電源完整性分析 (Taiwan)

Power integrity on PCB and package are closely related to chip-level design. Also, the die current is critical to planning PCB and package components and construction. Therefore, target impedance is quickly becoming the preferred method by IC vendors to specify package and board-level AC PDN requirements. This session first presents a practical method for how target impedance may be determined by IC vendors, including IC PDN transient current waveforms and impedance profiles. Then will provide an output impedance profile to let PKG/PCB designer follow up on the system PDN design.

On-Demand CadenceTECHTALK: What's New in Stratus High-Level Synthesis

Stratus continues to make great strides in advancing high-level synthesis. We continue to focus on improving core optimization, verification, streamlining analysis, and delivering tighter integrations to adjacent tools in the design flow. Watch our On-Demand CadenceTECHTALK to get an overview of the many recent improvements—as well as a sneak peek into our 2023 release plans.

31st IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)

VLSI-SoC 2023 explores the state-of-the-art in the areas of Very Large-Scale Integration (VLSI) and System-on-Chip (SoC) design. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixed-signal systems. Ziyad Hanna, Corporate VP, Research & Development for the System and Verification group will deliver a keynote talk and Cadence will host a workshop for the attendees.

On-Demand CadenceTECHTALK: Integrated Thermal Analysis for RF MMIC and PCB Power Applications (Taiwan)

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information. Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. With the recent integration of the Celsius Thermal Solver within the Cadence AWR Design Environment platform, RF designers now have access to electrothermal analysis for monolithic microwave IC (MMIC)/RFIC, PCB, and module designs.

CadenceCONNECT: Arm and Cadence: Achieving Best Silicon Power, Performance, and Area

Join Cadence and Arm to learn how you can achieve the best power, performance, area (PPA) and time to tapeout for Arm® CPU implementation using the latest Cadence® Digital Full Flow.

On-Demand CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges (Taiwan)

Learn how challenges related to MMIC/RFIC integration can be identified and resolved prior to tapeout through in-design EM analysis and MMIC/RFIC co-simulation using distributed, multiprocessing EM analysis for large-scale RF structures with the Clarity 3D Solver and AWR Microwave Office circuit design software.

CadenceTECHTALK:如何用 Protium企业级原型设计工具提高生产率，降低成本

Join our webinar as we identify the key requirements and challenges with prototyping, and how using enterprising prototyping systems like Cadence’s Protium system reduce the costs associated with them.

On-Demand Cadence and Rohde & Schwarz Joint Webinar: 從設計到實現 RF待測物 — EDA模擬中RF功率放大器線性化的優勢 (Taiwan)

R&S與 Cadence 合作開發的新解決方案，可增強廣泛用於執行 EDA 模擬的功能，允許在 EDA 系統模擬和硬體測試中使用真實信號，從而簡化 RF 零件和系統的開發過程。 This webinar is intended for engineers who design RF frontends and RF power amplifiers and striving for the best possible error vector magnitude (EVM) performance.We will introduce a new joint solution for linearization developed together with R&S.

NSBE 49th Annual Convention

Join Cadence at NSBE49, the National Society of Black Engineers 49th annual convention in Kansas City, MO, where Black students and professionals are inspired to take their engineering or engineering-related careers to the next level. Visit Cadence in person at Booth 435, March 23-24, beginning at 11:00am CST to learn more about our culture and career opportunities.

On-Demand CadenceTECHTALK:Reduce Turnaround Times with an RF/microwave Front-to-Back PCB Workflow (Taiwan)

在專門設計環境中開發的射頻/微波 IP 必須轉移到 PCB 繪製軟體中，在軟體中，生產限制、設計規則檢查 (DRC)、電路佈局驗證 (LVS) 以及企業認可的組件，才能與功率及電子設備整合操作。 RF 設計數據（設計圖和佈局）的傳輸通常由佈局團隊手動重新輸入由RF團隊所提供的資訊，浪費了大量的時間和精力。 Cadence® AWR Design Environment® 平台和 Allegro® PCB 設計軟體之間的工作流程互通性使 RF 和佈局團隊能夠更有效地共享數據，減少設計周轉時間並避免因手動輸入導致的潛在錯誤。本場線上研討會將介紹從 RF 到 PCB 的工作流程，並重點介紹設計團隊如何提高生產力和縮短上市時間的方法。