Overview
Sixth-Generation Vision DSPs for Imaging, Computer Vision, and AI
The Cadence Tensilica Vision 230 DSP delivers up to 2.18 tera operations per second (TOPS), 2.6X higher total TOPS than the Vision 130 DSP. To address the increasing computational requirements for embedded vision and AI applications, the sixth-generation Vision 230 DSP provides up to 2X greater AI and floating-point performance than the Vision 130 DSP. The Vision 230 DSP is specifically optimized for simultaneous localization and mapping (SLAM), a technique commonly used in the robotics, drone, mobile, and automotive markets to automatically construct or update a map of an unknown environment, and in the AR/VR market for inside-out tracking.
Key Benefits
Area and Power Optimized
Low power compared to host CPU and GPU
Vision/Image Processing
Instruction set optimized for computer vision and image processing applications
High Performance
> 1TOPS AI performance for object detection, image classification, image segmentation
Features
Cadence, through its Tensilica processor IP, brings together best-in-class products and services from industry leaders to help you accelerate the development of your SoC designs while meeting your demanding power and performance requirements. Browse the list of Tensilica processor IP service partners below.
Partners
Cadence, through its Tensilica processor IP, brings together best-in-class products and services from industry leaders to help you accelerate the development of your SoC designs while meeting your demanding power and performance requirements. Browse the list of Tensilica processor IP service partners below.
Technologies
Functional Safety for Automotive
Cadence is committed to enabling Functional Safety applications across the Tensilica processor lineup, whether it's an off-the-shelf processor/DSP IP or a custom domain-specific processor for a specific application
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