Allegro X Advanced Package Designer Training
날짜 | 버전 | 국가 | 위치 | |
---|---|---|---|---|
Scheduled upon demandOn demand | EnrollINQUIRE |
Length: 3 Days (24 hours)
Become Cadence Certified![](https://cdn2.dcbstatic.com/files%2Fc%2Fa%2Fcadence_docebosaas_com%2Fwysiwyg_upload%2F1668117719638-J12081_Allegro_Package_Designer_Plus_SPB22_1.png)
Course Description
In this course, you learn the complete flow of a package design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output. You will create a BGA package containing a flip-chip and wire-bonded stacked die together with discrete components.
Learning Objectives
After completing this course, you will be able to:
- Develop a process flow to suit your design needs
- Create a cross section and design constraints
- Wire bond a stacked die design
- Use the 3D Canvas to view your design in three dimensions
- Route the design using interactive and automatic methods
- Generate a variety of manufacturing outputs
Software Used in This Course
Allegro Package Designer Plus
Software Release(s)
SPB221
Modules in this Course
- Introducing Allegro® Package Designer Plus
- Creating a New Package Design
- Modifying Components and Netlist
- Setting Design Rules
- Wire Bonding
- 3D Viewing
- Embedded Components
- Routing and High-Density Interconnect
- Design Verification and Manufacturing Output
Audience
- IC Package Designers
Prerequisites
Before taking this course, you should have a working knowledge of:
- IC package design and construction
Related Courses
Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here.
Free Online Training Bytes (Videos)ONLINE TRAINING
Genus Synthesis Solution v16.1
This online class features the Cadence® Genus™ Synthesis Solution with next generation synthesis capabilities and how SoC design productivity gap is filled by Genus
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“The lab document is well structured and easy to navigate. It covers almost all basic aspects of IC package design in detail. Overall, it was fun to complete the exercises.”-Online Course-
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