The vigorous development of AI technology such as GPT and other large language models has put forward greater demand for underlying technologies such as large computing power and high IO throughput. OIF organization has launched the CEI-224G project in 2020. If it continues to use PAM4 technology same as 112G serdes , the Nyquist frequency will be as high as 56GHz, which poses a great challenge to package design. It’s very difficult to achieve such a large bandwidth using traditional design and simulation processes. This paper proposes to use Clarity 3D Workbench for automatic parametric modeling, combined with the Optimality Explorer intelligent optimization engine, to realize the optimal design of impedance discontinuous structures such as package vias and ball pads. Compared with traditional manual optimization which usually takes 2~ 3 weeks, workflow of Optimality AI optimization based on automatic parametric modeling only takes 1~ 2 days, which can quickly and efficiently explore the optimal design space. Meanwhile, this paper also discusses the key packaging process parameters that affect signal quality of 224G Serdes, including layer stackup, materials, solder ball size, pad size, anti-pad size, etc.. And it finally achieves return loss below -15dB, insertion loss within -0.5dB, TDR impedance within 93Ohm +/-7%, in whole 56GHz frequency band. At last, this paper also studies different pinmap/ballmap patterns, and analyzes their impact on crosstalk.