Celsius Thermal Solver Training
Date | Version | Country | Location | |
---|---|---|---|---|
14 - 15 Aug 2024 | 2023HF4 | Sweden | Kista-Stockholm Sweden |
ENROLL |
14 - 15 Aug 2024 | 2023HF4 | United Kingdom Of Great Britain And Northern Ireland | Bracknell-London United Kingdom Of Great Britain And Northern Ireland |
ENROLL |
23 - 24 Oct 2024 | 2023HF4 | France | Vélizy-Paris France |
ENROLL |
11 - 12 Nov 2024 | 2023HF4 | Sweden | Kista-Stockholm Sweden |
ENROLL |
11 - 12 Nov 2024 | 2023HF4 | United Kingdom Of Great Britain And Northern Ireland | Bracknell-London United Kingdom Of Great Britain And Northern Ireland |
ENROLL |
Scheduled upon demandOn demand | EXPRESS INTERESTINQUIRE |
Version | Region | |
---|---|---|
2023HF4 | Online | ENROLL |
2023 | Online | ENROLL |
2021HF3 | Online | ENROLL |
Other Versions | Online | EXPRESS INTERESTINQUIRE |
Length: 1.5 day (12 hours)
Become Cadence Certified
Course Description
This course introduces the Celsius™ Thermal Solver. Thermal analysis is critical for predicting the effect of temperature distribution on the design of integrated circuits, packages, PCBs and systems. With decreasing product size and increasing complexity, it is imperative that any thermal compliance issues are detected and resolved early in the design cycle. Celsius Thermal Solver provides a unified platform for modeling complex geometries and studying the effect of airflow and heat transfer in and around these geometries. In Celsius Thermal Solver, all objects (conductors, dielectrics, vias, components, and heat sinks) are modeled with unstructured mesh elements. Celsius Thermal Solver employs 3D finite element method (FEM) analysis to solve electrical and thermal equations for solid components and finite volume method (FVM) to solve Navier-Stokes equations for fluid areas of the design.
Learning Objectives
After completing this course, you will be able to:
- Import PCB and IC packaging data into Celsius Thermal Solver
- Create boundary conditions and set up VRMs and sink components for an electrical and thermal co-simulation
- Run a static E/T co-simulation and view the resulting tables and graphs
- Run a transient E/T co-simulation and view the resulting tables and graphs
- Build a 3D heatsink
- Import and export components from projects
- Set parameters and run sweep simulations
- Import PCB and IC package layered structures
- Run E/T co-simulations on layer structures and view the results
- Run a CFD flow for thermal analysis of a PCB with a chassis and fans
Software Used in This Course
- Celsius Thermal Solver
Software Release(s)
SIGRITY2023HF4
Modules in this Course
- Solid Object Static Simulation for 3D Structures
- Solid Object Transient Simulation for 3D Structures
- Building a 3D Heat Sink
- Sweeping Parameters
- Solid Object E/T Co-Simulation for Layered Structures
- CFD Flow for PCB Thermal Analysis
Audience
- Signal Integrity Engineer
- PCB and IC Package Designers
Prerequisites
You must have experience with or knowledge of the following:
- Basic PCB and IC packaging concepts
- Basic knowledge of 3D thermal and electrical simulation
Related Courses
Please see course learning maps at this link for a visual representation of courses and course relationships. Regional course catalogs may be viewed here.
Free Online Training Bytes (Videos)