Webinar
Overcoming System-Level 3D-IC Electrical and Thermal Challenges
![Overcoming System-Level 3D-IC Electrical and Thermal Challenges](/content/dam/cadence-www/global/en_US/images/resources/On-demand-webinars/system-level-3d-ic-electrical-thermal.jpg)
The last webinar series, "Adopting a Faster, More Efficient Path to Multi-Chiplet Design," will address the growing system analysis challenges 3D-IC designers face related to signal, power, and thermal integrity and will demonstrate how facing these concerns through simulation during system planning and signoff accelerates the 3D-IC design cycle.