Addressing Performance and Reliability Concerns with Thermal Analysis for RF Power Applications

This European Microwave Week (EuMW) presentation replay presents a powerful workflow for in-design thermal analysis of an RF power amplifier implemented and simulated with Microwave Office software and Celsius Thermal Solver. After discussing thermal challenges and their impact on device reliability and performance, the speaker presents an elegant solution for deriving temperature performance from Celsius Solver using readily available circuit geometries, stack-up material thermal properties, and power dissipation data derived from Microwave Office harmonic balance simulations, all performed within the AWR Design Environment platform.