Past Events

CadenceCONNECT: HLS Design and Verification Seminar 2023

高位合成テクニカル・フォーラムを本年も開催いたします。高位設計・検証に関わる成功事例や新しい技術アップデートなど、様々なご提案を準備いたしましたので、是非、ご参加ください。

RF & Microwave Design Seminar

The seminar will focus on advances in microwave engineering and technology, and will explore the latest developments in high frequency design and applications.

Cadence TECHTALK: Large Eddy CFD Simulation for Automotive Aerodynamics

Wall-modeled large eddy simulations (WMLES) of complex vehicle geometries offer highly accurate results but can be challenging in terms of speed and cost. In this webinar, learn how to maximize the throughput of these simulations with Fidelity CharLES and how the solver’s GPU acceleration lowers the cost of using WMLES in engineering design.

On-Demand CadenceTECHTALK: Simulation of Ship Seakeeping and Roll Decay Using CFD

In this webinar, Vincent Jacobs, Hydrodynamicist and CFD Specialist at Van Oossanen will explain how they used CFD simulation to predict the ship's roll decay, from mesh to simulation, and which options ensure good-quality simulations. He will then compare the CFD results with alternative methods, such as towing tank tests and empirical methods.

Microwave Workshops and Exhibition（外部サイトに移動します）

RF/Microwave 設計、AI／マシンラーニング、電磁界解析、熱解析、シグナルインテグリティ設計ソリューションを展示します。また、11月30日の出展企業セミナーでは、シグナルインテグリティ解析最新情報をご紹介します。

Design Solution Forum 2023（外部サイトに移動します）

ケイデンスの講演では、チップレット技術の動向とケイデンスのチップレット設計向けIPおよび3D-ICツールソリューションをご紹介します。

On-Demand CadenceTECHTALK: Enabling Electromagnetic Simulations with Encrypted Components

Join our CadenceTECHTALK as we discuss how Cadence enables the ecosystem and supports model creators by allowing them to encrypt their geometries and protect their IP while sharing them with their customers for simulation. This webinar will demonstrate the use of these models for complete system designs and showcase some of Cadence's Clarity encrypted models that are part of a library developed by Modelithics.

DVCon Europe 2023

Join Tim Pylant, Solutions Group Director, on November 14 at 4pm for his presentation on Exploring New Frontiers of High-Performance Verification with UVM-AMS. Join this talk as we introduce the UVM-AMS methodology and show how to adapt existing UVM environments to work with three abstractions of a mixed-signal design. Be sure to visit booth #304 to speak with our technical experts.

SEMICON Europa 2023

Cadence is proud to be a platinum sponsor for SEMICON Europe, the event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. Be sure to attend Cadence presentations with Karna Nisewaner, Corporate VP, General Counsel & Corporate Secretary Cadence and Rebecca Dobson, Corporate Vice President EMEA.

CadenceCONNECT: The Race is On!

Join Cadence on November 13, at Cadence headquarters in San Jose as we present a new generation of automotive electronics chip design full-process solutions. Learn about the most recent advancements in the field of automotive chips, including upcoming technology trends and innovations.

CadenceTECHTALK: Stratus HLS（高位合成）セミナーシリーズ（５）

（その５）高位合成RTLの検証とStratus統合フロー編では、高位合成が生成したRTLの検証と、高位合成とその他ツールを使用した統合フローについて見ていきます。前半ではシミュレーションを実行して、どのように高位合成RTLを検証するかについてご説明し、後半では高位合成ツールと協調する、最新の設計フローについてご紹介します。

Arm Tech Symposia 2023 Japan（外部サイトに移動します）

ケイデンスの講演では、チップレット化が検証チームにもたらす課題に対処するための最速かつ最も包括的なソリューションを提供する Cadence System VIP、 Heliumおよび Dynamic Duo をご紹介します。

PCB Carolina 2023

Visit Cadence at PCB Carolina on Wednesday, November 8, 2023, to discover the latest Cadence Allegro and OrCAD technologies for reduced design turnaround time and increased productivity.

On-Demand CadenceTECHTALK: Proactive Energy Management/Capacity Planning for Today’s Data Centers

This webinar will describe how digital twins are deployed at scale via integration and automated workflows and provide a software demonstration of the proactive capacity planning toolset.

On-demand CadenceTECHTALK: RF/高周波設計・解析ウェビナー

ケイデンスのRFソリューションの最新情報をご紹介します。フロントエンドの高周波設計に活用できるCadence AWR Design Environmentの特長、オンチップ電磁界解析ソルバーEMXの最新バージョンEMX2023.1の新機能をご説明します。

ARMMS Conference 2023

Come and visit Cadence at our exhibition space from 6-7 November to discuss circuit, system, thermal, PCB and EM simulation for RF/microwave product development.

CadenceCONNECT: IR2.0 - Building a New Paradigm for Power Integrity

Join us for our upcoming CadenceCONNECT: IR2.0 – Building a New Paradigm for Power Integrity Design and Analysis. At this event you will learn from technical experts in academia, foundries, the design community, and Cadence on how we are addressing Power Integrity challenges.

SHPE 2023

Join Cadence at the 2023 SHPE National Convention, the largest gathering of Hispanics in STEM. Watch Jeannette Guinn’s talk, “Be You – Everyone Else Is Taken (Part 2),” on Thursday, November 2, at 2:00pm and visit the Cadence career fair booth on Friday, November 3, and Saturday, November 4, to learn more about our culture and career opportunities.

WE23

Join Cadence at WE23, the world’s largest event for women in engineering and technology. Join us in booth 1437 at the Career Fair on Thursday, October 26, and Friday, October 27, to get to know Cadence, what we do, and how we can work together.

CadenceTECHTALK: Gate - Level Simulations at Warp Speed with the Xcelium Multi-Core App

Don’t be left behind! Join us and catapult your GLS to warp speed, ensuring your projects are not stalled by long pole tests but mastered with precision and efficiency.

On-Demand CadenceTECHTALK: Enhance Verification Quality with Mixed-Signal Verification Using Xcelium Mixed-Signal App

Over multiple decades, design verification (DV) has evolved towards catching bugs earlier in the design cycles, allowing an exponential increase in the functionality of SoCs. Extending those improvements to mixed signal is critical for continuous growth. This CadenceTECHTALK goes over many of the silicon-proven approaches enabling it, and DV engineers will find immense value in the contents. Specifically, it covers solutions to those challenges in mixed-signal verification (MSV) using the capabilities of the Xcelium Mixed-Signal App.

CadenceTECHTALK: UCIe-Based Chiplet Verification - from IP to SoC

In this webinar, we will explore challenges and effective solutions to optimize effort and improve productivity in the verification using “Chiplet-like” reusable verification components. This caters to all possible topologies enabling continuous verification from IP to Subsystem and finally, at the system-level.

Cadence Pegasus System on AWS Cloud: Customer Immersion Event

Join the AWS and Cadence product teams for a half-day workshop and networking event to gain insight into optimized costs and productivity with AWS Cloud and the Pegasus Solution. Examine the features of Pegasus Signoff Platform, such as Pegasus TrueCloud, FlexCompute, and Console.

On-Demand CadenceTECHTALK: Streamlined CFD Workflow for Complex Automotive Geometries

Discover how Fidelity supports engineers in overcoming challenges by providing efficient data management and a responsive GUI, efficient technology for meshing complex geometries while maintaining high-quality mesh and much more.

AESIN Tech Talk

Join us online at AESIN TECHTALK where we discuss the thermal management of electric drivetrains, the importance of thermal simulation and the role that Celsius EC Solver can play in that process.

On-Demand CadenceTECHTALK: High-Accuracy Cavitation Simulation of Hydrofoils

Discover how to streamline your workflow for cavitation analysis, making it faster and boosting its robustness, with adaptive grid refinement in Fidelity Fine Marine.

Samsung Foundry Forum 2023

Visit Cadence at Samsung Foundry Forum, an event which will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries.

CadenceTECHTALK: Soar to New Heights of Productivity using Cadence Managed Cloud Service (Asia)

Register now | CadenceTECHTALK: Soar to New Heights of Productivity using Cadence Managed Cloud Service for Asia timeframe. Join this webinar to learn how the Cadence-managed, EDA-optimized, ready-to-use, and secure ISO-certified cloud platform delivers a fully integrated and proven environment to jump-start product design, verification, and implementation.

2023 Cadence中国技术巡回研讨会 -系统验证及IC验证研讨会专场

2023 CadenceCONNECT: China Technology Day is coming soon! This year we will hold seminar in many cities including Chengdu, Xi'An, Beijing. Cadence will bring you best practices and ideas. Come and join us!

CadenceCONNECT Vietnam Technology Seminar 2023

CadenceCONNECT Vietnam event will introduce you to optimized design methodologies for electronics system applications. The event brings together Cadence technology users, developers, and industry experts for networking, sharing best practices on critical design and verification issues and discovering new techniques for designing advanced silicon, SoCs, and systems. Registration is now open, and seats are limited. Don't miss this opportunity to learn from industry experts and connect with peers in the electronics community.

ThermalLIVE 2023: System-Level Thermal Signoff from Chips Through to Racks

Join this webinar as we look at an electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures using Cadence’s Celsius technologies.

On-Demand CadenceTECHTALK: Soar to New Heights of Productivity using Cadence Managed Cloud Service

Soar to New Heights of Productivity using Cadence Managed Cloud Service. Learn how the Cadence-managed, EDA-optimized, ready-to-use, and secure ISO-certified cloud platform delivers a fully integrated and proven environment to jump-start product design, verification, and implementation.

CadenceCONNECT: The Race Is On!

Join Cadence on October 18 at Brazos Hall in Austin as we present a new generation of automotive electronics chip design full-process solutions. Learn about the most recent advancements in the field of automotive chips, including upcoming technology trends and innovations.

ELIV Europe 2023

Attend ELIV Congress and discover the future of the automotive electronics & software industry. Visit Cadence in the exhibition hall and speak with our experts about In-Vehicle Infotainment and Automotive Radar and Vision.

31st IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)

VLSI-SoC 2023 explores the state-of-the-art in the areas of Very Large-Scale Integration (VLSI) and System-on-Chip (SoC) design. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixed-signal systems. Ziyad Hanna, Corporate VP, Research & Development for the System and Verification group will deliver a keynote talk and Cadence will host a workshop for the attendees.

Numerical Towing Tank Symposium

Cadence is proud to be a Silver Sponsor of the Numerical Towing Tank Symposium. The event aims to provide a forum for informal discussions among experts in the field and to disseminate latest results.

Electrical Performance of Electronic Packaging and Systems Conference

Visit Cadence at the 32nd Conference on Electrical Performance of Electronic Packaging and Systems to learn more about In-Design Multi-Physics System Analysis. EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

CadenceTECHTALK: Stratus HLS（高位合成）セミナーシリーズ（４）

[その４] 結果分析とマイクロアーキテクチャ探索編では、高位合成の適用フローを理解し、最終RTLの品質をどのようにして高めていくべきかについて見ていきます。

On-Demand CadenceTECHTALK: Proactively Address Thermal Concerns in Advanced IC Packages

This webinar will show how design teams that practice thermal mitigation strategies early in the design cycle face fewer thermal concerns with their IC package prototypes. We will walk through a reference design and discuss how the Cadence Advanced Package Designer Plus combined with the Celsius Thermal Solver addresses feasibility during the design planning stage to the full system final signoff.

2023 Cadence中国技术巡回研讨会 - 定制/模拟设计研讨会专场

2023 CadenceCONNECT: China Technology Day is coming soon! This year we will hold seminar in many cities including Shenzhen, Xi'An, Beijing, Wuxi. Cadence will bring you best practices and ideas. Come and join us!

CadenceLIVE Europe 2023

CadenceLIVE Europe 2023 will be held on October 10-11 at the Holiday Inn Munich City Centre. It features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products.

CadenceCONNECT CFD Europe

CadenceCONNECT CFD Europe will feature presentations from your industry colleagues that will offer solutions for today’s fluids analysis challenges that impact the design and development of tomorrow’s products. CadenceCONNECT CFD Europe brings users, developers, and industry experts together to connect, share ideas, and inspire design creativity. CadenceCONNECT CFD Europe will be hosted alongside CadenceLIVE Europe 2023.

7x24 Change International Forum

Visit Cadence at the 7x24 Change International Forum. This event is designed for anyone involved with 7×24 infrastructures – IT, data center, disaster recovery and network/telecommunication managers, computer technologists, facility or building managers, supervisors and engineers.

ITC 2023

As a Silver sponsor, join Cadence at the International Test Conference (ITC) to learn about Cadence Modus DFT Software Solution for Intelligent System Test. Attend our technical session papers on Scaling Physically Aware Logic Diagnosis to Complex High Volume 7nm Server Processors and PA Optimization of Testpoints in Automotive Designs.

AESIN Annual Conference - AESIN Tech talk

Join us online at AESIN TECHTALK at 12:00-12:30 GMT, October 5th, 2023, where we discuss the thermal management of electric drivetrains, the importance of thermal simulation, and the role that Celsius EC Solver can play in that process.

On-Demand CadenceTECHTALK: Verisium Debug for UVM Testbench

Watch the On-Demand recording where our experts dive into the features available in Verisium Debug and learn how to debug UVM testbench using Verisium Debug.

TSMC Europe Open Innovation Platform Ecosystem Forum 2023

Cadence is proud to be a sponsor of the TSMC OIP Ecosystem Forum. Join us and attend our six in-person presentations on Cadence digital, analog, IP, and 3D-IC solutions. Visit our booth and chat with our experts about the latest enabling technologies for digital full-flow, signoff, custom, and design IP solutions.

IMAPS Symposium 2023

Join Cadence at the International Microelectronics Assembly and Packaging Society (IMAPS)'s 56th International Symposium on Microelectronics, where we will be showcasing our advanced IC packaging and cross-domain co-design automation solutions through the presentations on design tools and flows for chip(let) generation and co-designing and analyzing chip(let), package, and board systems.

DCD Connect Live London

Visit Cadence at DCD Connect Live London and expect a 'high density' experience where you will be exposed to new ideas, new technologies and make meaningful new contacts.

ECOC Exhibition 2023

ECOC is Europe’s largest exhibition within the fibre optic communication technology industry. Visit Cadence at stand #469 from 2-4 October, to discover more about our hi-speed SerDes solutions.